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| Weidmüller’s
printed-circuit board terminals LSF-SMT with ‘Push In’ direct
insert technique – insert the wire. Ready! – 100% continuity
for the SMT manufacturing process. – Available in six pitches from 3.5 to 7.62 mm – 90° or 180° wire exits – ideal for lead-free soldering. |
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| By adding the PCB-terminals LSF-SMT with ‘Push In’ direct insertion technique, which are also suitable for front plate cut-outs – simply insert the insulation-stripped solid core wire. Ready! – Weidmüller is expanding its extensive programme of PCB terminals for the pitches 3.5/3.81, 5.00/5.08, and 7.50/7.62 mm. The block style PCB terminals are available with wire exits of 90° (horizontal) or 180°(vertical) to the | ||||||||
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printed-circuit board, with solder pin lengths of 1.5 or 3.5 mm and housings made from the black, highly heat-resistant, halogen-free insulating material LCP GF (Liquid Crystal Polymer with glass-fibre reinforcing) in 2- to 8-pole and 24-pole versions (pitches: 3.5/3.81 mm). They are offered in machine-oriented packaging ‘tape-on-reel’. This allows them to be processed together with the other SMT components in the reflow soldering process. Weidmüller’s components fulfil the demands contained in the RoHS Directive (Reduction of Hazardous Substances). The innovative PCB terminals LSF-SMT allow the customer to observe the upcoming WEEE Directive today (Waste from Electrical and Electronic Equipment). The concept of the LSF-SMT with ‘Push In’ direct insertion technique is ideal for a lead-free future. With the cost situation as it is today, safe and reliable connection systems that enable complex electronics and devices to be wired efficiently are of fundamental importance. These premised the creation of the new PCB terminals LSF-SMT with ‘Push In’ direct insertion technique. Easy and safe handling features as well as low wiring times are impressive characteristics of this innovative new PCB terminals LSF-SMT with ‘Push In’ direct insertion technique. Easy and safe handling features |
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| Figure 1: Weidmüller’s
PCB terminals LSF-SMT with ‘Push In’ direct insert technique
for 3.5 to 7.62-mm pitches – insert the wire. Ready! – Finely
tuned for lead-free soldering processes. Fig. No.: Sä 24058 D |
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| as well as low wiring times
are impressive characteristics of this innovative connection system. Once
stripped of insulation, the solid core wire is simply inserted into the
terminal point until it butts against the stop. Ready! No tools are required
to make the connection. Insert flexible wires into the open terminal point – press
the release button – the connection is ready.
‘
Push In’ can accommodate solid or flexible wires with cross-sections
from 0.14 to 1.5 mm2 (AWG 24-16), with or without ferrules;
furthermore, it has been designed as a TOP system,
which means: wire insertion and spring operation
to disconnect the connected wire are carried out in parallel
to one another. The nominal current is 17.5 A (VDE). In accordance with
VDE regulations, the nominal voltage, which is pitch dependent, is as follows:
3.5/3.81 mm =160 V, 5.00/5.08 mm = 250 V und 7.50/7.62 mm = 500 Volt. Rated
data to UL and CSA is 300 Volts (industrial) and 10 Amperes. |
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The ‘Push In’ contact system has been designed according to the pressure spring principle, which means, the spring for the wire connection is retained separately in a cage. The principle behind this construction guarantees that mechanical and electrical functions are kept separate. The advantage: greater wire extraction forces. The pressure spring is protected by a stop restricting spring excursion. The cable entry funnel prevents the wire being inserted incorrectly. Moreover, flexible wires do not split apart when being inserted. Of course the direct insertion technique guarantees a reliable, vibration-resistant and gas-tight connection – as do all of Weidmüller’s connection systems. The material from which the LSF-SMT PCB terminals
are made |
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| Surface and lengths of the pins in Weidmüller PCB components | ||||||||
| The solder pins’ surfaces in the contact zone of the LSF-SMT PC terminals now on offer are made from pure tin (100% Sn). Pure tin is also used in the soldering area, so that no problems with respect to ‘mixing’ of lead-based materials and lead-free compositions can arise. This means that lead-free solder alloys pose no problems. They fulfil the applicable standards for lead-free soldering: DIN 45598 Class IV, 260 °C - 280° C for solder alloys SnAg and SnCu. That means that conflicts with EU directives need not be feared when the component assemblies are later recycled. The innovative PCB terminals LSF-SMT are equipped with two soldering pins. These guarantee a safe and reliable connection to the PCB. LSF-SMT offers the user a choice between 1.5-mm and 3.5-mm long soldering |
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pins. Weidmüller recommends using the short 1.5-mm pins for SMT and THR processes. These require only a little soldering paste; moreover, trouble-free outgassing of the flux during the soldering process is guaranteed. The 3.5?mm pins are more suited for conventional soldering processes, manual and wave soldering. | |||||||
| Figure 2: Weidmüller’s
PCB terminals LSF-SMT with ‘Push In’ direct insert technique – (from left to right): insert the solid core wire into the terminal point. Ready! To remove the wire: simply press the release button and withdraw. Fig. No.: Sä 24057 D |
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Page Code: 774-01 |
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