To round off its product range, POWERSEM (Distributor: Henskes Electronic Components) has now extended its ECO-PAC™ product family by a range of IGBT and MOSFET modules. In its ECO-PAC™ 1 and ECO-PAC™ 2 variants with identical housing height, the ECO-PAC™ performance module developed exclusively by POWERSEM offers the customer an unmatched range of circuits. Small, space-saving and compact, with a standard height of only 9 mm, the customer can choose from amongst over 80 circuit configurations. Currents from 6 to 230 A and blocking voltages up to 1800 V are standard. Due to the standardised height of 9 mm, switch circuits in the ECO-PAC™ 1 and those in the ECO-PAC™ 2 housing can be combined with each other on the same circuit board. Gold-plated connection pins guarantee good soldering properties on the circuit board. The ECO-PAC™ concept is especially well suited for specific customer solutions, since both the arrangement and number of connections, and the number and type of the semi-conductor chips used can be freely selected.

The pin arrangement can be optimised in such a way as to minimise inductivity by means of extremely short connections to the circuit board. The free selection of the pin arrangement also enables optimum use of the substrate area. The use of a ceramic substrate and the lack of a copper baseplate ensure optimum heat dissipation, and has a positive effect on the reliability and working life of the module.

Two sealing compounds are used as standard for all POWERSEM modules. A 3 mm-thick silicon layer directly above the semi-conductor chips ensures reduction of the mechanical stresses caused by the heating-up of the module. A further epoxy layer seals the module against external effects such as air humidity.

All ECO-PAC™ 1 and ECO-PAC™ 2 products are equipped with connection pins with an equaliser to reduce the stress when the module is under a thermal load.

Due to the small dimensions, the ECO-PAC™ concept offers a weight- and space-saving solution, which in turn allows the user, because of the low space requirements of the modules, to reduce the dimensions of his own equipment. The compact design of the modules also allows materials savings, thereby reducing manufacturing costs.

A particularly space-saving and extremely compact design is offered by the SLIM-PAC™ housing, a module with a housing height of only 6 mm. For applications with limited space requirements, the rectifier bridges in the ECO-PAC™ 1 can also be supplied in the SLIM-PAC™.

Page Code: 150-02